You have to be sure to run the appropriate profile for the material being processed. The big difference between running Tin Lead and Lead Free is profile. Solder paste stays on the pcb and does not "contaminate" the Reflow oven.Īnd even if Tin Lead or Lead Free solder fell on to the bottom of the oven (as part of a pin-in-paste application for instance) it would not affect any performance at board level. This question is an important one for Wave solder as pot contamination can be a big issue.īut on the Reflow solder side, there really is no issue. Al has been a significant contributor to the development and optimization of reflow and rework processes and systems, particularly lead-free transitions and microelectronic applications. His expertise includes through-hole, surface mount and semiconductor packaging with an emphasis on soldering and heat transfer. Consultation with specific oven manufacturers is recommended, they should be able to provide oven related details.Īl Cabral is Regional Sales Manager for Finetech and Martin rework products. If desired, atmosphere samples can be collected and analyzed from strategic locations within the Reflow oven's process chamber to confirm.Īdditionally, oven components or subsystems that inherently collect process by-products such as exhaust manifolds, traps, collectors, condensers and exhaust stacks can be examined as well. Modern convection dominant Reflow ovens exchange atmospheres at relatively high rates, continuously introducing fresh gas (air or N2) and exhausting as required. Intimate contact within the solder interconnects is prohibited by design, limiting lead migration to the Reflow oven's atmosphere. It's highly unlikely that dedicated Reflow ovens are required to process lead base and lead free alloys for traditional SMT applications. How critical is the requirement to use separate reflow ovens for my leaded and lead-free assemblies? Reflow for leaded and lead-free assemblies
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